flip chip bonder manual

Heater Stage, bond Starter Kit, copper Kit, pick and Place.
Full HD Camera, overlook no detail, thanks high resolution camera with optical zoom.Exact placement from Die, stamp or dispenser.The thermosonic bonding advantages described below and the disadvantages of lead-free solder are stimulating the growth of this low temperature gold-to-gold connection.Thermosonic bonding of flip chips has advanced greatly over the years. .Camera angles, free changeable camera angle with optical zoom for a good and easy verification.Epoxy Stamping, the dresden files jim butcher pdf fast and precise stamping process, x-Y Micrometer screws.
Auto Vacuum Pump integrated vacuum pump turns on automatically at Pick Place.
Epoxy Dispensing, simple and exact handling, inspection.
Angle alignment, microchip alignment thru the rotable work plate.
Originally limited to small die with low bump counts, improved equipment now allows larger die with higher bump counts.
Visual inspection of microassembly for example from soldering, bonding or flip chip.
Tpt, choose your bonder hB70 Manual Die Bonder, pick Place.
Originally limited to ceramic substrates, thermosonic assemblies are now made on a variety of organic substrates.Wedge bonding, ball bonding 2017 by TPT.True vertical Z movement, motorized Z-axis with 90 linear movement.Pick Microchip max player for windows 8 from Die-Carrier and place it to your surface.Visual inspection of microassembly for example from soldering, bonding or flip chip.